Microelectronics Packaging and Assembly Engineer
Company Name:
Applied Physics Laboratory
## Position Description
Introduction:
The Johns Hopkins University Applied Physics Laboratory (APL), a national leader in scientific research and development, located midway between Baltimore and Washington, DC is seeking a Microelectronics Packaging and Assembly Engineer.
Job
Summary:
Serve as a technology leader in the design, fabrication and assembly of microelectronic devices, multichip modules, hybrid microcircuits and various other miniature electronic systems. Maintain a leading-edge knowledge and understanding of microelectronic packaging and assembly technology, and continuously advance the capability. Lead microelectronic packaging and assembly projects, working with customers todevelop requirements, determine technical approaches, design solutions, schedule and perform work, and track and report progress. Design, assemble, and test microelectronics for R&D; projects, highly miniaturized electronic modules, spacecraft instruments, and other high reliability applications.
Design includes researching applicable technologies, evaluating their efficacy, and making appropriate assembly drawings. Assembly includes setup and operation of automatic and manual wirebonders, epoxy dispensers, die bonders, flip-chip bonders, seam welders, YAG lasers, and plasma cleaners. Project management includes scheduling, tracking, resource allocation, and conflict resolution.
Duties (Listed in order of importance with the estimated amount of time spent at each task):
1. Manage a portfolio of advanced electronic packaging projects (30%)
2. Design and assemble microelectronic modules (60%)
3. Maintain technology leadership in microelectronic packaging and assembly (10%)
Note: This job summary and listing of duties is for the purpose of describing the position and its essential functions at time of hire and may change over time.
## Qualifications
Required Qualifications:
1. B.S. Degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
2. Five years of experience in microelectronic packaging, assembly, and process development.
Qualifications:
1. M.S. Degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
2. Ten years of experience in microelectronic packaging, assembly, and process development.
3. Project management experience.
Special Working Conditions:
1. Ability to work in a cleanroom environment.
2. Ability to work using an optical microscope while manipulating small, delicate electronic components.
Security: Applicant selected will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.
Benefits: APL offers a comprehensive benefits package including a liberal vacation plan, a matching retirement program, significant educational assistance, a scholarship tuition program for staff with dependents, and competitive salaries commensurate with skills and experience. For more information about our organization, please visit our web site at .
Equal Employment Opportunity: Johns Hopkins University/Applied Physics Laboratory (APL) is an Equal Opportunity/Affirmative Action employer that complies with Title IX of the Education Amendments Acts of 1972, as well as other applicable laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or protected Veteran status.
Primary Location: United States- Maryland- Laurel
Schedule: Full-time
Req ID: 07764Estimated Salary: $20 to $28 per hour based on qualifications.
Applied Physics Laboratory
## Position Description
Introduction:
The Johns Hopkins University Applied Physics Laboratory (APL), a national leader in scientific research and development, located midway between Baltimore and Washington, DC is seeking a Microelectronics Packaging and Assembly Engineer.
Job
Summary:
Serve as a technology leader in the design, fabrication and assembly of microelectronic devices, multichip modules, hybrid microcircuits and various other miniature electronic systems. Maintain a leading-edge knowledge and understanding of microelectronic packaging and assembly technology, and continuously advance the capability. Lead microelectronic packaging and assembly projects, working with customers todevelop requirements, determine technical approaches, design solutions, schedule and perform work, and track and report progress. Design, assemble, and test microelectronics for R&D; projects, highly miniaturized electronic modules, spacecraft instruments, and other high reliability applications.
Design includes researching applicable technologies, evaluating their efficacy, and making appropriate assembly drawings. Assembly includes setup and operation of automatic and manual wirebonders, epoxy dispensers, die bonders, flip-chip bonders, seam welders, YAG lasers, and plasma cleaners. Project management includes scheduling, tracking, resource allocation, and conflict resolution.
Duties (Listed in order of importance with the estimated amount of time spent at each task):
1. Manage a portfolio of advanced electronic packaging projects (30%)
2. Design and assemble microelectronic modules (60%)
3. Maintain technology leadership in microelectronic packaging and assembly (10%)
Note: This job summary and listing of duties is for the purpose of describing the position and its essential functions at time of hire and may change over time.
## Qualifications
Required Qualifications:
1. B.S. Degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
2. Five years of experience in microelectronic packaging, assembly, and process development.
Qualifications:
1. M.S. Degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
2. Ten years of experience in microelectronic packaging, assembly, and process development.
3. Project management experience.
Special Working Conditions:
1. Ability to work in a cleanroom environment.
2. Ability to work using an optical microscope while manipulating small, delicate electronic components.
Security: Applicant selected will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.
Benefits: APL offers a comprehensive benefits package including a liberal vacation plan, a matching retirement program, significant educational assistance, a scholarship tuition program for staff with dependents, and competitive salaries commensurate with skills and experience. For more information about our organization, please visit our web site at .
Equal Employment Opportunity: Johns Hopkins University/Applied Physics Laboratory (APL) is an Equal Opportunity/Affirmative Action employer that complies with Title IX of the Education Amendments Acts of 1972, as well as other applicable laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or protected Veteran status.
Primary Location: United States- Maryland- Laurel
Schedule: Full-time
Req ID: 07764Estimated Salary: $20 to $28 per hour based on qualifications.
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